Intel Haswell

The new chips will still be running on the same 22nm production process, but with a new architecture that should see the graphics performance of the HD 4600 graphics components doubling.

That should give us some rather tasty-performing Ultrabooks, and with the upgraded GT3E version of the HD graphics on the mobile side we should get some svelte gaming laptops too.

One of the interesting points is the increase in TDP from the 77W of the Ivy Bridge up to 84W in the new Haswell chips. I expect that’s mostly down to the beefier graphics components with higher clockspeeds.

Sadly there’s no boost in the general clockspeed of the CPUs themselves. We’re still limited to 3.5GHz for the top-end i7-4770K and 3.4GHz for the i5-4670K.

It’s not a surprise to see Intel isn’t upping the core count either – sticking to four cores/eight threads for the i7 series and four cores/four threads for the i5.

Performance

Compared to Ivy Bridge (expected):

• At least 10% CPU performance increase.
• Double the performance of the integrated GPU.

Features carried over from Ivy Bridge

• A 22 nm manufacturing process.
• 3D tri-gate transistors.
• A 14-stage pipeline (since the Core microarchitecture).
• Mainstream up to quad-core.
• Native support for dual channel DDR3.
• 64 kB (32 kB Instruction + 32 kB Data) L1 cache and 256 kB L2 cache per core.

Confirmed new features

Haswell New Instructions (includes Advanced Vector Extensions 2 (AVX2), gather, bit manipulation, and FMA3 support).

• New sockets — LGA 1150 for desktops and rPGA947 & BGA1364 for the mobile market. It is possible that Socket R3 will replace LGA 2011 for server Haswells
• Intel Transactional Synchronization Extensions (TSX).
• Graphics support in hardware for Direct3D 11.1 and OpenGL 4.0.
• DDR4 for the enterprise/server variant (Haswell-EX).
• Variable Base clock (BClk)^[18] like LGA 2011.
• Supervisor mode access prevention (SMAP)

Expected features

• Shrink PCH from 65 nm to 32 nm.
• A new cache design.
• Up to 32MB Unified cache LLC (Last Level Cache).
• Support for Thunderbolt technology.
• There will be three versions of the integrated GPU: GT1, GT2, and GT3. According to vr-zone, the fastest version (GT3) will have 20 execution units (EU). Another source, SemiAccurate, however says that the GT3 will have 40 EUs with an accompanying 64MB cache on an interposer. An additional source, AnandTech, agrees that GT3 will have 40 EUs, and states there will be a version with up to 128MB of embedded DRAM, but makes no mention of an interposer.^[27][28] Haswell's predecessor, Ivy Bridge, has a maximum of 16 EUs.
• New advanced power-saving system.
• Fully integrated voltage regulator, thereby moving a component from the motherboard onto the CPU.
• 37, 47, 57W thermal design power (TDP) mobile processors.
• 35, 45, 65, 84, and ~100W+ (high-end, Haswell-E) TDP desktop processors.
• 10W TDP processors for the Ultrabook platform (multi-chip package like Westmere) leading to reduced heat which results in thinner as well as lighter Ultrabooks, but performance level will be lower than the 17W version.

Haswell Lineup

資料來源: http://www.pcgamer.com/2012/12/13/intels-haswell-i5-and-i7-line-ups-leaked/
http://en.wikipedia.org/wiki/Haswell_(microarchitecture)